Ultra Sort

The Corning Tropel Ultra Sort represents the State Of The Art in automated semiconductor wafer measurement, and continues a 25 year tradition of providing metrology solutions to semiconductor manufacturers. Designed specifically for high volume wafer manufacturing, this automated system offers the utmost in rapid, repeatable, accurate non-contact verification of many substrate materials.

The Ultra Sort is as an automated wafer flatness and thickness analysis system that includes cassette-to-cassette handling with user configurable sorting capability. This Class 100 compliant system integrated a grazing incidence interferometer with industry standard robotic wafer handling. The Ultra Sort can be configured to measure wafer sizes from 2 through 8 inches in diameter, and is well suited for a wide variety of materials including Gallium Arsenide, Sapphire, Quartz, Germanium, and Silicon.

Specifications:

Accuracy 50 nm (2.0 u")

Repeatability 15 nm (0.6 u") 1 sigma

Resolution 5 nm (0.2 u")

Dynamic Range (typical, limited by surface slope) > 100 um (0.004")

Part Range 50 mm - 200 mm (2" - 8")

Part Range Configuration 50 mm - 150 mm; 100 mm - 200 mm

Measured Data Points ~ 230,000 per measurement

Measurement Time ~ 5 seconds (typical)

Throughput = Clamped OR Unclamped ~ 120 wafers per hour

Throughput = Clamped AND Unclamped ~ 90 wafers per hour

Measurement Datums Front referenced, back referenced, clamped, local site

Measurement Parameters Bow, Warp, SORI, TTV, LTV, LDOF, Thickness, Stress, and others. Contact us for a complete list.

Data Analysis 3-D, Contour plot, 2-D slice plots, Histogram, and others. Contact us for a complete list.

Surfaces Wire Sawn, ground, lapped, polished, etched

Now available with Optical Character Recognition!

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Ultra Sort

Send mail to webmaster@ldb-enterprises.com with questions or comments about this web site. Last modified: February 04, 2006

Send mail to webmaster@ldb-enterprises.com with questions or comments about this web site.
Last modified: February 04, 2006